Thin Film Manufacture
1. Noble coating methods
Spin coating, ink-jet coating, screen coating, dip coating, etc. are
conventional coating methods of manufacturing devices. In our
lab, we make simple changes to the coating methods to reduce
the processing time and the amount of active materials.
Spin coating is the most commonly used coating method on lab
scale and usually takes 30-60 seconds of coating time. We found
that a short time process (a few seconds of spin coating time)
improve molecular ordering by induce self-assembly of the polymers.
In bi-phasic dip-coating, the polymer solution is locating only on
the top, reducing the amount of wasted polymer solution.
Moreover, the stability of the polymer solution can be increased
by using the solubility parameter of the two solvents.
2. Phase separation
Self Assembled Monolayers(SAMs) are monolayers formed by self-assembly of molecules and it is widely used for hydrophilic and hydrophobic surface modification.
We controlled the surface hydrophilicity
through SAMs to induce phase separation in
the polymer layer. Controlling the surface
properties can be useful in the two phase
3. Organic-Inorganic hybrid film
Since their lightness, low cost and flexibility, organic
materials are widely used in electronic devices.
However, stability and device performances are lower than
that of inorganic materials.
We applied Metal Organic Materials(MOFs), which are
organic-inorganic hybrid material, in to semiconducting layer.
By manufacturing hybrid film, we improved stability and
performance of devices. Also we fabricated gas sensors by
using selective gas adsorption characteristics of MOFs.